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SPIE Photomask 2007
Date: September 17 - 21 , 2007
Location: Monterey Marriott & Monterey Conference Center, Monterey, California
Booth: 314

DISKCON USA Tradeshow and Conference
Date: September 19 - 20, 2007
Location: Hyatt Regency Hotel & Santa Clara Convention Center. Santa Clara, California
Booth: 204

SPIE Advanced Lithography
Date: February 26 - 27, 2008
Location: San Jose Convention Center, San Jose, California
Booth: 626
Semicon West
Date: July 15 - 17, 2008
Location: Moscone Center, San Francisco, California
Booth: 345


SPIE Photomask 2007
Date: September 18, 2007
Location: Monterey Marriott and Monterey Conference Center, Monterey, California
Title: "Signature Evaluation Using OCD Metrology " (Poster paper)

DISKCON 2007
Date: September 19, 2007
Location: Santa Clara Convention Center, Santa Clara, California, USA
Title: "Characterization of Perpendicular Magnetic Recording Media using Broadband Optical Reflectometry" (Poster paper)
SPIE Photomask 2007- Session 23: Metrology II
Date: September 20, 2007
Location: Monterey Marriott and Monterey Conference Center, Monterey, California
Title: "Measurements of Corner Rounding in 2-D Contact Holes on Phase Shift Masks"
Speaker: Alex Gray, n&k Technology

The 24th European Mask and Lithography Conference - EMLC 2008
Date: January 21 - 24, 2008
Location: Hilton Hotel, Dresden, Germany
Title: "Measuring Contact Hole Corner Rounding Uniformity Using Optical OCD Metrology "
Speaker: John Lam, n&k Technology


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To contact public relations:

e-mail: inforequest@nandk.com

phone: 408-513-3800

fax: 408-513-3850

standard mail:
n&k Technology, Inc.
80 Las Colinas Lane
San Jose, CA 95119

 

 
01-25-06 n&k Technology Solves Problem of Optically Measuring Pelliclized Photomasks

07-12-05 Semicon Daily News: Interview with Dr. Rahim Forouhi , President and founder of n&k Technology, Inc
01-01-04 International Fabtech (21 st Edition): Broadband spectrophotometry for phase-shift-mask metrology
03-10-03 Advanced Packaging: Characterization of Ultra-Thick Photoresists
02-15-03 Solid State Technology: Using Broad-Band Reflectrometry for fast trench-depth measurement